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Encapsulation Molding Product List

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Sealing molding of small electronic devices

Utilize sealing forming technology to enhance the added value and reduce costs of small electronic devices.

<Content> Hollow sealing molding refers to its characteristics, welding strength, weldability of the cable extraction part, case studies, and key points for sealing design (know-how). 【Features】 ○ Waterproof: Sealing performance (withstands internal pressure of 5 kgf) ○ Ultra-compact: No need for sealed components (screws, gaskets) ○ Reduced assembly costs: One-shot molding (labor-intensive reduction)

  • Other polymer materials
  • Resin processing machine
  • Encapsulation Molding

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